The latest report just confirms the previously leaked information about the Cupertino-based company planning to release it’s next iPhone device as much slimmer with just 6.1mm thin (1mm slimmer than its predecessor).
Moreover, Apple would get rid of 3.5mm audio jack and introduce a new set of Bluetooth headphones in order to make its next iPhone slimmer while retaining the same design profile, build height & width. As per reports, the iPhone 7 will be sporting a dual-speaker setup and a thinner cutout for the Lightning port.
Apart from ditching the 3.5mm headphone jack, Apple will also eliminate the rear camera bump in the iPhone making it coming in direct contact with the iPhone casing.
A thinner lightning port will be included to make the phone slimmer. The leading iPhone maker company would also be using EMI (electromagnetic interference) shield technology to major chips including RF (radio frequency), connectivity chips, AP (application processor), and modems which is expected to increase the iPhone’s performance while reducing electromagnetic interference experienced by chips.
As per a report earlier this month. A stereo speaker setup in the iPhone 7 was hinted for the iPhone and this addition might go a long way in improving its sound output as iPhones till now have sported only a single mono speaker